Fabrication of SiC MEMS Pressure Sensor Based on Novel Vacuum-Sealed Method
نویسندگان
چکیده
The fabrication of SiC MEMS pressure sensor based on novel vacuum-sealed method is presented in this paper. The sensor was fabricated using surface micromachining. Due to its excellent mechanical properties and high chemical resistance, PECVD (Plasma Enhanced Chemical Vapor Deposition) SiC was chosen as structural material. Polyimide is the sacrificial layer which solve stiction problem in process. STS PECVD system is utilized to realize releasing, deposition and vacuum sealing consecutively in the process chamber. By eliminating wafer cleaning between these processes and dry etching of sacrificial layer, stiction problem is prevented. Therefore, this new process achieved high yield and low cost.
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